2026 7th Thermal Management Industry Conference and Expo

The 7th Thermal Management Industry Conference and Expo will take place in 2026, designed to provide an efficient value connection platform for various stakeholders in the thermal management industry chain, promoting communication, cooperation, and win-win development. This year’s expo will focus on presenting a range of innovative materials, instruments, devices, as well as design and simulation solutions, showcasing patented technologies and practical application scenarios to help industry players identify and leverage the latest technologies and products.

During the exhibition, thematic forums, roundtable discussions, and closed-door seminars on topics in the thermal management domain such as science, materials, technologies, and engineering will also take place concurrently, providing exhibiting companies the opportunity to show breakthrough technologies and achievements from research institutions, facilitating the transfer of lab research to market applications. Exhibited content will include thermal management solutions for electronic devices, chips, and equipment, particularly tailored to applications in fields like consumer electronics, power electronics, and 5G technology.

Participants will benefit from industry resource integration and establish effective connections with over 70% of professional attendees while gaining insights into future development trends, and seizing extensive business opportunities. Additionally, the event will feature forum dialogues between enterprises for discussing industry innovation visions, raising brand exposure through new media and short videos.

This expo will also provide a platform for the launch of new products and technologies, attracting high-tech enterprises to showcase their innovations. The entire event will span the year, enhancing professionalism and effectiveness through a variety of pre-event activities, including demand-supply matching, project roadshows, policy interpretations, and investment recommendations.