2025 31st Integrated Circuit Design Industry Exhibition
20 November - 21 November, 2025
Western China International Expo City
Chengdu, Sichuan
88 Fuzhou East Road, Tianfu New Area, Chengdu City, Sichuan Province
四川省成都市天府新区福州路东段88号
Chengdu, Sichuan
88 Fuzhou East Road, Tianfu New Area, Chengdu City, Sichuan Province
四川省成都市天府新区福州路东段88号
The "Chengdu-Chongqing Integrated Circuit Annual Industry Development Forum and the 31st Integrated Circuit Design Industry Exhibition (ICCAD-Expo 2025)" will be held on November 20-21, 2025, at the Chengdu International Exhibition Center in Western China. The theme for this exhibition is "Chengyu Shared Core, Resonating Together on the Same Screen," aiming to gather experts, industry leaders, government officials, representatives from industry associations, and academia from both domestic and international integrated circuit sectors.
The event will facilitate in-depth discussions on the development trends, technological innovations, and market opportunities within the integrated circuit industry, thus promoting collaborative efforts globally. Renowned industry entrepreneurs and experts will share the latest technological advancements and offer insights into the future development of the industry. Additionally, Professor Wei Shaojun, the chairman of the Integrated Circuit Design Branch of the China Semiconductor Industry Association, will deliver a significant report titled "2025 Report on the Current Status and Development of China's Integrated Circuit Design Industry," providing key market insights for attendees.
There will be six major themed forums covering areas such as IC design, EDA (Electronic Design Automation), foundry processes, advanced packaging and testing, IP (Intellectual Property), investment in production, and local integrated circuit topics. For domestic enterprises, ICCAD-Expo serves as an excellent platform to showcase their latest products and technologies, connect with industry resources, and grasp global industry trends. For international companies, with China being the world's largest semiconductor consumer market for several consecutive years, ICCAD-Expo is the optimal channel for increasing brand international recognition and expanding into the Chinese market.
The exhibition will showcase the latest products and technologies from leading domestic and international enterprises involving EDA, IP, design services, manufacturing, packaging, and testing, covering all segments of the integrated circuit supply chain including design, manufacturing, testing equipment, materials, and chip applications.
The event will facilitate in-depth discussions on the development trends, technological innovations, and market opportunities within the integrated circuit industry, thus promoting collaborative efforts globally. Renowned industry entrepreneurs and experts will share the latest technological advancements and offer insights into the future development of the industry. Additionally, Professor Wei Shaojun, the chairman of the Integrated Circuit Design Branch of the China Semiconductor Industry Association, will deliver a significant report titled "2025 Report on the Current Status and Development of China's Integrated Circuit Design Industry," providing key market insights for attendees.
There will be six major themed forums covering areas such as IC design, EDA (Electronic Design Automation), foundry processes, advanced packaging and testing, IP (Intellectual Property), investment in production, and local integrated circuit topics. For domestic enterprises, ICCAD-Expo serves as an excellent platform to showcase their latest products and technologies, connect with industry resources, and grasp global industry trends. For international companies, with China being the world's largest semiconductor consumer market for several consecutive years, ICCAD-Expo is the optimal channel for increasing brand international recognition and expanding into the Chinese market.
The exhibition will showcase the latest products and technologies from leading domestic and international enterprises involving EDA, IP, design services, manufacturing, packaging, and testing, covering all segments of the integrated circuit supply chain including design, manufacturing, testing equipment, materials, and chip applications.
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