2025 World Semiconductor Conference and Expo

2025 World Semiconductor Conference and Expo
20 June - 22 June, 2025
Nanjing International Expo Center
Nanjing, Jiangsu
No. 300 Jiangdong Middle Road, Hexi, Nanjing, Jiangsu Province
江苏省南京河西江东中路300号

+8615251839398
Area: 18,000 m2
Exhibitors: 1,300+
Visitors: 160,000+
The World Semiconductor Conference and Nanjing International Semiconductor Expo is one of the most influential and iconic leading industry exhibitions in the semiconductor field in China, certified by UFI as an international brand exhibition. Since its inception, this event has successfully held six sessions, gathering over 1,300 exhibiting companies from 12 countries and regions, with attendees exceeding 160,000 from 23 different countries and regions.

As a well-known event based in Jiangsu, covering the entire country and aimed at the world, the conference aligns closely with the national technology development strategy. It brings together cutting-edge technologies and products related to IC design, wafer manufacturing, packaging and testing, semiconductor equipment and materials, and semiconductor applications, creating a comprehensive communication platform that integrates exhibition display, themed forums, and interactive exchanges.

The 2025 World Semiconductor Conference and Expo will be held from June 20 to 22, 2025, at the Nanjing International Expo Center. This three-day event will include a professional exhibition covering an area of 18,000 square meters and more than 20 conference activities, focusing on industry hotspots such as artificial intelligence, automotive electronics, AI applications, and talent exchange among universities. This will provide an excellent opportunity for companies along the industrial chain, experts and scholars, as well as industry organizations to communicate supply and demand needs, engage in dialogue with industry leaders, gain valuable insights, and understand industry trends.

Multiple exhibition areas will be set up, including a semiconductor design area, semiconductor manufacturing area, packaging and testing area, semiconductor equipment and materials area, third-generation semiconductor manufacturing area, terminal application area, and dedicated exhibition areas for 'Little Giants,' the 'Eagle Program,' and the 'Excellence Program' for talent.
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