NEPCON ASIA 2025 Shenzhen Asia Electronics Production Equipment and Microelectronics Industry Exhibition
28 October - 30 October, 2025
Shenzhen World Exhibition and Convention Center
Shenzhen, Guangdong
No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
广东省深圳市宝安区福海街道展城路一号
Shenzhen, Guangdong
No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
广东省深圳市宝安区福海街道展城路一号
Area: 45,000 m2
Exhibitors: 800+
Visitors: 38,000+
The exhibition introduces IC Packaging Summit, offering global perspectives through topics upgraded alongside summit tours and bespoke matchmaking activities, opening new business opportunities for participants.
Highlights of the exhibition include creating a panoramic vision of SMT technology, with leading worldwide companies like Panasonic, ASM, FUJI, HANWHA, and more showcasing a comprehensive range of technologies across production processes. Several themed days focus on different industry segments:
- Semiconductor Packaging Day: With summits and tailored buyer's routes to aid companies in grasping trends in advanced packaging.
- Automotive Electronics Day: Incorporates manufacturer and technology conferences and supplier-buyer meet-ups to focus on the automotive electronics development.
- New Energy Day: Features forums and technical solution sharing events, highlighting lithium battery, energy storage, and photovoltaic field successes.
The second day of the exhibition is titled “EMS Day,” specifically designed for the Electronic Manufacturing Services industry. The activities of the day are aimed at fulfilling the needs of the EMS professionals for learning, networking, and professional exploration. The exhibition serves as a dynamic platform for electronic manufacturing service enterprises, supporting their continued industry advancement.
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