2027 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition
18 May - 20 May, 2027
Hefei Binhu International Convention and Exhibition Center
Hefei, Anhui
3899, Jinxiu Avenue, Baohe District, Hefei
安徽省合肥市包河区锦绣大道3899号
Hefei, Anhui
3899, Jinxiu Avenue, Baohe District, Hefei
安徽省合肥市包河区锦绣大道3899号
Need help with this expo?
CNToolbox can assist with event registration, route planning, and providing participant
lists and contact details, as well as arranging meetings or on-site
support upon request.
As global digital transformation accelerates, semiconductors have become the "industrial heart" of the digital age, serving as the fundamental cornerstone for key strategic areas such as 5G, artificial intelligence, new energy vehicles, and advanced computing. As a strategic and foundational national industry, semiconductors have received multiple policy supports under initiatives like "Made in China 2025" and the "14th Five-Year Plan," leading to a steady expansion of the global market and a rapid restructuring of the industry landscape, hence presenting significant development opportunities.
The "2027 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition" will be grandly held from May 18 to 20, 2027, at the Hefei Binhu International Exhibition Center. The exhibition continues with the core theme of "Winning the Chip Era, Creating a Chip Future" and is based on Hefei's industrial advantages as the "Capital of China's IC" and the dividends from the Yangtze River Delta integrated development strategy, focusing on the innovative synergy of the entire semiconductor industry chain while aiming to create an international high-end platform that integrates technology display, business matching, academic exchanges, and ecological co-construction.
The exhibition will assist domestic and foreign enterprises in deepening cooperation and sharing development opportunities, collectively crafting a new blueprint for global semiconductor industry development. The 2027 exhibition is set to further expand and upgrade, striving to attract more global leading enterprises and top research institutions to participate, focusing on technological breakthroughs, supply-demand matching, cross-border cooperation, and talent exchange. By fostering collaborative innovation, it will help domestic and foreign enterprises seize industry opportunities and work together to build a new ecosystem for the semiconductor industry, promoting high-quality global semiconductor industry development.
In the review of the last exhibition, renowned companies from Hefei and beyond gathered, including Hefei Xianwei Semiconductor, Yiyue Technology, and Hockheimer, with over 300 distinguished participants showcasing state-of-the-art technologies, core equipment, and innovative solutions, greatly promoting the deep integration of the industry and supply chains.
Moreover, the exhibition is clearly divided into various areas covering IC design, integrated circuit manufacturing, materials, equipment, electronic components, new displays & smart terminals, big data and artificial intelligence, among others. Each area showcases the latest technologies and products in the industry. For instance, the IC design area features various chip designs, including 5G communication chips and AI chips; the integrated circuit manufacturing area focuses on wafer production; and the materials area spans a wide range of semiconductor materials. These zones will provide exhibitors with opportunities to showcase technology, engage in business discussions, and facilitate cooperation, further advancing the semiconductor industry.
The "2027 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition" will be grandly held from May 18 to 20, 2027, at the Hefei Binhu International Exhibition Center. The exhibition continues with the core theme of "Winning the Chip Era, Creating a Chip Future" and is based on Hefei's industrial advantages as the "Capital of China's IC" and the dividends from the Yangtze River Delta integrated development strategy, focusing on the innovative synergy of the entire semiconductor industry chain while aiming to create an international high-end platform that integrates technology display, business matching, academic exchanges, and ecological co-construction.
The exhibition will assist domestic and foreign enterprises in deepening cooperation and sharing development opportunities, collectively crafting a new blueprint for global semiconductor industry development. The 2027 exhibition is set to further expand and upgrade, striving to attract more global leading enterprises and top research institutions to participate, focusing on technological breakthroughs, supply-demand matching, cross-border cooperation, and talent exchange. By fostering collaborative innovation, it will help domestic and foreign enterprises seize industry opportunities and work together to build a new ecosystem for the semiconductor industry, promoting high-quality global semiconductor industry development.
In the review of the last exhibition, renowned companies from Hefei and beyond gathered, including Hefei Xianwei Semiconductor, Yiyue Technology, and Hockheimer, with over 300 distinguished participants showcasing state-of-the-art technologies, core equipment, and innovative solutions, greatly promoting the deep integration of the industry and supply chains.
Moreover, the exhibition is clearly divided into various areas covering IC design, integrated circuit manufacturing, materials, equipment, electronic components, new displays & smart terminals, big data and artificial intelligence, among others. Each area showcases the latest technologies and products in the industry. For instance, the IC design area features various chip designs, including 5G communication chips and AI chips; the integrated circuit manufacturing area focuses on wafer production; and the materials area spans a wide range of semiconductor materials. These zones will provide exhibitors with opportunities to showcase technology, engage in business discussions, and facilitate cooperation, further advancing the semiconductor industry.
Upcoming Related Events
24 March - 26 March, 2027
in 8 months
2027 Munich Shanghai Electronic Production Equipment Exhibition
Computers, Communications and Electronic Equipment
The 2027 Munich Shanghai Electronic Production Equipment Exhibition will be held from March 24-26 at the Shanghai New International Expo Center, showcasing cutting-edge technologies and products in global electronic manufacturing, including SMT, harness processing, and intelligent testing, making it an ideal platform for industry exchange and matchmaking.
30 March - 2 April, 2027
in 8 months
2027 Shanghai International Commercial Building Facilities and Property Management Expo
Comprehensive Sectors
Energy Saving and Environmental Protection
Public Safety
Computers, Communications and Electronic Equipment
The 2027 Shanghai International Commercial Building Facilities and Property Management Expo is a vital communication platform for the property industry, showcasing intelligent equipment, low-carbon technologies, and property management solutions to help traditional property companies expand into commercial space management.
20 May - 22 May, 2027
in 9 months
2027 China (Xiamen) International Industrial Expo and the 31st Cross-Strait Mechanical and Electronic Products Trade Fair
Industrial Machinery
Engineering Machinery
Food Processing Equipment
Computers, Communications and Electronic Equipment
The 2026 Xiamen Industrial Expo concluded successfully at the Xiamen International Convention and Exhibition Center, covering an exhibition area of 70,000 square meters with 716 high-quality exhibitors and attracting over 100,000 professional visitors. The event focused on digitalization, intelligence, and greening, showcasing the innovation and vitality of China's manufacturing sector.
16 June - 18 June, 2027
in 10 months
2027 11th CMM Shenzhen Electronic Manufacturing Automation & Resources Exhibition
Industrial Machinery
Computers, Communications and Electronic Equipment
Food Processing Equipment
The 2027 11th CMM Electronic Manufacturing Automation & Resources Exhibition will be held from June 16-18 in Shenzhen, in conjunction with the South China Robot Exhibition. It will focus on showcasing new technologies and resources across the entire electronic manufacturing process, providing a comprehensive platform for industry upgrades.