SIA 2027 Shanghai International Semiconductor Technology Conference and Exhibition
16 June - 18 June, 2027
National Exhibition and Convention Center (Shanghai)
Shanghai
333 Songze Avenue, Shanghai
上海市崧泽大道333号
Shanghai
333 Songze Avenue, Shanghai
上海市崧泽大道333号
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Area: 60,000 m2
Exhibitors: 1,000+
Visitors: 100,000+
Shanghai stands as the core for design, application, and distribution within the domestic semiconductor industry, maintaining a leading position in IC design capabilities across the country. The exhibition is set to cover 60,000 square meters, expected to gather over 1,000 quality enterprises from around the globe, attracting more than 100,000 professional visitors for exchanges and discussions. The exhibition will focus on frontier technologies, innovative products, and industry solutions, creating a comprehensive platform for brand display, technical exchange, business cooperation, and resource connectivity. It will also enhance communication between domestic and international industries while accurately conveying market dynamics and technological trends.
Special zones will be set up within the exhibition, including a wafer manufacturing area, a compound semiconductor area, an EDA/IP and design services area, a packaging and testing area, an components area, and an automotive semiconductor area. These zones will showcase a wide array of products across numerous subfields such as wafer processing, materials like silicon carbide and gallium nitride, electronic design automation software, and semiconductor products required by the automotive industry—making it a crucial event not to be missed in the sector. We sincerely invite global semiconductor industry colleagues to gather in Shanghai to explore new markets and create a bright future for development together.
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