ICPF Semiconductor Packaging Technology Exhibition

The ICPF Semiconductor Packaging Technology Exhibition is a significant event in the industry, scheduled to take place from October 28 to 30, 2025, at the Shenzhen International Convention and Exhibition Center (Baoan). This exhibition will focus on the latest developments in semiconductor packaging technology, covering core themes such as IGBT and SiC module packaging. It is expected to attract over 165,000 visitors and more than 3,500 exhibitors, exploring the innovations and applications within the semiconductor industry. The exhibition layout includes demonstrations of IGBT and SiC module packaging processes, as well as trends in advanced packaging technology. During the event, related technical forums will be held to share the latest technologies and application trends in the semiconductor field, making it a platform for professionals to communicate and collaborate.