2025 Liquid Cooling Technology and Temperature Control Service Customization Negotiation Conference

2025 Liquid Cooling Technology and Temperature Control Service Customization Negotiation Conference
3 December - 5 December, 2025
Shenzhen World Exhibition and Convention Center
Shenzhen, Guangdong
No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
广东省深圳市宝安区福海街道展城路一号

Area: 23,000 m2
Exhibitors: 150,000+
Visitors: 48,000+
In the context of the "dual carbon" goals and the rapid advancement of the digital economy, liquid cooling technology has become an essential temperature control solution in energy storage, data centers, and industrial manufacturing. This negotiation conference focuses on liquid cooling technology and its customization services, aiming to satisfy the growing demand for personalized solutions. Attendees will have the chance to discuss the latest industry trends and technological advancements.

According to exhibition data, this conference includes over 23,000 square meters of specialized exhibitions with more than 1,200 booths, expected to attract over 48,000 professional visitors and 3,500 buyers, with a total audience flow estimated to reach over 150,000 people.

We have specifically invited key personnel from research institutions and application fields across the country, with a focus on sectors including photovoltaics, food, power electronic devices, pharmaceuticals, batteries, energy storage, servers, data centers, quick-freezing facilities, and charging piles.

The exhibition will prominently feature the following areas:

1. Core Liquid Cooling Technologies: This includes cold plate liquid cooling systems designed for efficient heat dissipation of servers and chips; immersion cooling devices, a fully enclosed heat dissipation system for high-density data centers; and spray liquid cooling technology, which provides localized efficient cooling tailored to specific needs.

2. Key Components: Various types of cooling fluids (such as fluorinated fluids and water-based coolants), liquid cooling plates, pipes, quick connectors, piping technologies, and heat management module components (including compressors and evaporators).

3. Supporting Materials: Various thermal interface materials (such as liquid metals and thermal grease), insulation materials (like aerogels and vacuum insulation panels), and carbon-based materials (such as graphene thermal films and carbon fiber gaskets) that enhance heat dissipation efficiency.

4. Temperature Control Customization Services: This includes integrated temperature control systems employing hybrid cooling techniques, liquid-cooled air conditioners, heat pump systems, mini heat pipes, uniform temperature panels, and liquid cooling cabinets.

5. Testing and Production Equipment: This comprises leakage detection instruments and thermal property measurement devices, as well as manufacturing equipment such as vacuum filling machines and automated welding devices. This exhibition will provide attendees with abundant opportunities for technical exchange and collaboration.
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