2025 ELEXCON Shenzhen International Electronics Exhibition

2025 ELEXCON Shenzhen International Electronics Exhibition
26 August - 28 August, 2025
Shenzhen Convention and Exhibition Center
Shenzhen, Guangdong
No. 111, Fuhua 3rd Road, Futian District, Shenzhen City, Guangdong Province
广东省深圳市福田区福华三路111号

+864009029920
Area: 30,000 m2
Exhibitors: 412+
Visitors: 31,000+
The 2025 ELEXCON Shenzhen International Electronics Exhibition will take place from August 26 to 28, 2025, at the Shenzhen Convention Center (Futian). This year's theme is "AII for AI, AIl for GREEN: Providing Full-Stack Technology and Supply Chain Support for AI and Dual-Carbon Goals." The exhibition will focus on showcasing cutting-edge products and technologies, including AI and computing chips, storage solutions, embedded AI, power supply and energy electronics, high-performance electronic components, and Chiplet heterogeneous integration ecosystems.

Covering popular fields such as artificial intelligence, new energy vehicles, industrial automation, rail transit, and the Internet of Things, the exhibition aims to showcase the latest technological innovations and trends in industry development. As an international event, a series of technical forums will also be held to present global industry dynamics and future technological trends, attracting numerous industry experts and technical personnel, including those in the embedded exhibition area where innovative technologies such as AI industrial computers, embedded processors, and edge AI computing platforms will be showcased.

The power supply and energy electronics section will feature power management ICs, power semiconductors, optical energy storage and data center power solutions, among other technologies. Additionally, over 300 technical and management personnel from energy storage, server, and digital energy fields in South China will be invited to engage in purchasing and exchanges.

In the semiconductor exhibition area, the Chiplet ecosystem, system-in-package, electronic design automation software and services, among others, will be on display, covering advanced technologies from 3D IC design services to power packaging and ceramic substrates. This exhibition is not only a platform for showcasing the latest technologies but also promotes industry communication and collaboration.
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