2025 16th China Semiconductor Industry and Application Expo

The 2025 16th China Semiconductor Industry and Application Expo will gather leading companies from the global semiconductor sector to showcase the latest technological advancements and innovative applications. The expo will focus on chip design and wafer fabrication, covering integrated circuit design, chip development, electronic design automation (EDA), microcontrollers (MCU), and the equipment and components needed for wafer production. Exhibitors will present a range of products from traditional semiconductor materials to cutting-edge packaging technologies.

In the realm of advanced packaging, the expo will highlight emerging technologies such as Chiplet, system-in-package (SiP), wafer-level packaging (WLP), 3D packaging, and panel-level packaging (PLP), and will showcase various substrate technologies, including organic, silicon, and glass substrates. Notably, exhibits will include packaging substrates, IC carriers, and semiconductor packaging materials and equipment, reflecting the current technological forefront and dynamics of the semiconductor industry.

Additionally, the expo will prominently feature semiconductor-specific equipment and components, such as thinning machines, single crystal furnaces, grinders, thermal treatment equipment, and lithography machines—essential tools in the semiconductor manufacturing and processing landscape. This expo will provide a platform for industry experts, scholars, and exhibitors to engage in communication and collaboration, aimed at advancing and innovating within the Chinese semiconductor sector.