2026 34th China International Exhibition on Electronic Production Equipment and Microelectronics Industry
21 April - 23 April, 2026
Shanghai World Expo Exhibition and Convention Center
Shanghai
1099 Guozhan Road, Pudong New Area, Shanghai
上海市浦东新区国展路1099号
Shanghai
1099 Guozhan Road, Pudong New Area, Shanghai
上海市浦东新区国展路1099号
+862122317010
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The 2026 34th China International Exhibition on Electronic Production Equipment and Microelectronics Industry is set to be a landmark event, showcasing approximately 600 exhibitor brands and companies focused on launching groundbreaking PCBA products. The exhibition will include diverse areas such as Surface Mount Technology (SMT), smart factories and automation technology, dispensing and coating, testing and measurement, and Electronic Manufacturing Services (EMS), highlighting the latest advancements in electronic production equipment and microelectronics technology.
Continuing its strategic focus on automotive electronics, this event will feature thematic technical seminars and sourcing activities related to automotive manufacturing, aiming to attract renowned brand enterprises and buyers from the automotive sector. It is estimated that 35,000 high-end electronic manufacturing buyers from industries such as medical, automotive, telecommunications, servers, and large-scale industrial control products will attend, offering them the chance to experience cutting-edge industry products, gain insights on leading technologies and solutions, and interact with business partners throughout the supply chain.
Key exhibition zones include:
1. SMT Surface Mount Exhibit Area: Showcasing SMT-related products such as placement, printing, packaging, and component feeding systems, this area gathers renowned domestic and international brands, serving as a vital trading platform in the industry.
2. Testing and Measurement Exhibit Area: In response to the emergence of new technologies and materials, this area presents the latest professional testing and measurement solutions.
3. Electronic Micro-Assembly and SiP Process Demonstration Zone: This zone conceptualizes SMT+Packaging (SiP), creating a professional exhibition platform for complete electronic micro-assembly, PCB assembly, and finished product assembly solutions.
4. Welding and Dispensing Exhibit Area: This section offers an ideal platform for business expansion, catering to the new demands in the welding and dispensing field.
5. Electronic Materials Exhibit Area: Utilizing a “conference + exhibit” format, this area provides an effective commercial platform for electronic materials companies to engage with end-users in research and user feedback, project management roles, and technical support.
6. Smart Factories and Automation Technology Exhibition: This area focuses on showcasing “Industrial Automation” technologies and “System Integration” solutions applicable in electronic manufacturing, boosting industry innovation and development.
Continuing its strategic focus on automotive electronics, this event will feature thematic technical seminars and sourcing activities related to automotive manufacturing, aiming to attract renowned brand enterprises and buyers from the automotive sector. It is estimated that 35,000 high-end electronic manufacturing buyers from industries such as medical, automotive, telecommunications, servers, and large-scale industrial control products will attend, offering them the chance to experience cutting-edge industry products, gain insights on leading technologies and solutions, and interact with business partners throughout the supply chain.
Key exhibition zones include:
1. SMT Surface Mount Exhibit Area: Showcasing SMT-related products such as placement, printing, packaging, and component feeding systems, this area gathers renowned domestic and international brands, serving as a vital trading platform in the industry.
2. Testing and Measurement Exhibit Area: In response to the emergence of new technologies and materials, this area presents the latest professional testing and measurement solutions.
3. Electronic Micro-Assembly and SiP Process Demonstration Zone: This zone conceptualizes SMT+Packaging (SiP), creating a professional exhibition platform for complete electronic micro-assembly, PCB assembly, and finished product assembly solutions.
4. Welding and Dispensing Exhibit Area: This section offers an ideal platform for business expansion, catering to the new demands in the welding and dispensing field.
5. Electronic Materials Exhibit Area: Utilizing a “conference + exhibit” format, this area provides an effective commercial platform for electronic materials companies to engage with end-users in research and user feedback, project management roles, and technical support.
6. Smart Factories and Automation Technology Exhibition: This area focuses on showcasing “Industrial Automation” technologies and “System Integration” solutions applicable in electronic manufacturing, boosting industry innovation and development.
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