2025 14th Shenzhen International Heat Conduction and Dissipation Materials and Equipment Exhibition

2025 14th Shenzhen International Heat Conduction and Dissipation Materials and Equipment Exhibition
4 June - 6 June, 2025
Shenzhen World Exhibition and Convention Center
Shenzhen, Guangdong
No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
广东省深圳市宝安区福海街道展城路一号

Area: 30,000 m2
Exhibitors: 600+
Visitors: 40,000+
The 2025 14th Shenzhen International Heat Conduction and Dissipation Materials and Equipment Exhibition (CIME) will be held from April 6 to April 8, 2025, at the Shenzhen International Convention and Exhibition Center. This year’s exhibition is expected to attract over 40,000 visitors and more than 600 exhibitors, covering an area of 30,000 square meters. Since its inception in 2013, CIME has been designed to meet the rapidly evolving demands of the heat conduction and dissipation materials sector, becoming a well-known event and a resource exchange platform in the industry.

The exhibition will encompass a wide range of areas including heat conduction materials, heat dissipation components, analysis and testing, processing equipment, and thermal design. Exhibited products will include high thermal conductivity materials, electronic packaging materials, and thermal management equipment. Additionally, it will showcase the latest technological solutions and products aligned with the progressive needs of industries like 5G, artificial intelligence, and the Internet of Things regarding cooling technology upgrades. CIME is not merely a platform for companies to display their products and technologies; it is a significant space for industry communication and collaboration, providing quality services and comprehensive solutions for enterprises.

Visitors will be able to learn about the latest advances in thermal conduction materials, emerging new products, and applications, facilitating connections and collaborations with industry peers while exploring future development trends. The exhibition will also host expert forums to discuss the future of heat conduction and dissipation technologies.
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