2027 South China International Semiconductor Packaging Testing Technology and Equipment Exhibition (South China Industry Fair)

The 2027 South China International Semiconductor Packaging Testing Technology and Equipment Exhibition (South China Industry Fair) will be held from June 16 to 18, 2027, at the Bao'an International Convention and Exhibition Center in Shenzhen. This exhibition has attracted widespread attention primarily due to the explosion of AI computing power driving the demand for advanced packaging, including the rapid adoption of Chiplet, 2.5D, and 3D packaging technologies. Additionally, the rise of electric vehicles has consistently increased the demand for automotive-grade chip packaging. The Guangdong-Hong Kong-Macao Greater Bay Area has formed a vibrant semiconductor industry corridor, with new production lines and technology upgrades releasing massive procurement needs for equipment and materials.

The exhibition will feature an exclusive exhibition area of 10,000 square meters, focusing on four main display segments related to advanced packaging core areas, including core equipment, substrate materials, testing equipment, and clean intelligent manufacturing solutions. Exhibits will include various packaging and testing equipment such as die bonders, wire bonders, molding machines, pick-and-place machines, probe stations, test machines, and sorting machines, as well as essential materials and cleanroom systems that meet the production requirements of precision packaging workshops. The exhibition will also showcase smart manufacturing and automation technologies, including collaborative robots for packaging lines and AI machine vision inspections, aimed at exhibiting intelligent upgrade solutions for packaging factories.

Target audiences include packaging and testing factories, IC design companies, wafer enterprises, and research/development/procurement departments of 3C electronics, storage, and electric vehicle industries. The exhibition will also attract electronic contract manufacturers, component manufacturers, equipment agents, and traders. Notable participating companies from the previous exhibition included Delta Electronics, Biwin Storage, and Laird Precision, illustrating the exhibition's influence and appeal. Overall, the 2027 South China International Semiconductor Packaging Testing Technology and Equipment Exhibition will serve as a significant event within the semiconductor industry, providing an important platform for communication, collaboration, and technological showcase.