2026 Shenzhen International AI Computing Power and Data Center Liquid Cooling Technology Exhibition

As AI large models and high-performance computing rapidly iterate, the global demand for computing power is skyrocketing. High-density, intelligent, and green data centers have become the core infrastructure of the digital economy. The application standards for computing power across various industries in 2026 will undergo comprehensive upgrades, further intensified by the tightening of energy consumption regulations under the policies of “dual carbon” and “East Data West Computing”. Liquid cooling technology has become a necessity for deploying high-density computing power. Currently, the national government is vigorously supporting the construction of computing power and green data centers, accelerating the layout of intelligent computing centers, and transitioning the computing power architecture towards pooling integration and cloud-edge-end collaboration.

As a core city of the digital economy in the Guangdong-Hong Kong-Macao Greater Bay Area, Shenzhen attracts leading technology and AI innovation companies and possesses a complete industrial chain in information and communication, along with advantageous policies for green computing power and an open market.

The 2026 Shenzhen International AI Computing Power and Data Center Liquid Cooling Technology Exhibition will take place from October 28-30, 2026, at the Shenzhen Convention and Exhibition Center, themed “Building the Foundation of Computing Power, Empowering with Liquid Cooling, Interconnectivity, and Ecological Prosperity”. The exhibition aims to create a comprehensive professional platform integrating technology display, product trading, industry matchmaking, and trend releases. We warmly invite global leaders in computing power, data centers, and liquid cooling sectors, innovative research teams, investment institutions, and industry colleagues to gather in Shenzhen to explore new opportunities in the industry and promote the green, high-quality development of the domestic computing power sector.

Concurrent forum activities will include the Innovation Forum on Liquid Cooling Technology in Data Centers, Forum on Intelligent Computing Center Construction and Computing Power Scheduling, Forum on Green Data Centers and PUE Optimization, Forum on Low Carbon Transformation and Energy Saving in Data Centers, AI Computing Power Chip and Hardware Ecology Forum, Data Center Supply Chain Matchmaking Meeting, and a Special Matching Session for High-Density Computing Power Cooling Solutions.

Exhibits will cover AI computing power infrastructure, including various AI computing chips like GPUs, CPUs, DPUs, NPUs, and FPGAs, liquid-cooled servers and high-density AI servers, 800G/1.6T high-speed optical modules and related networking devices, liquid cooling heat dissipation systems such as cold plate and immersion liquid cooling solutions, energy-saving and intelligent systems for data centers, as well as comprehensive computing power application solutions, which are all crucial aspects of the exhibition.