2025 China International Compound Semiconductor Industry Expo
8 April - 11 April, 2025
China Optics Valley Convention and Exhibition Center
Wuhan, Hubei
No. 787 Gaoxin Avenue, Donghu High-Tech Development Zone, Wuhan City, Hubei Province
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Wuhan, Hubei
No. 787 Gaoxin Avenue, Donghu High-Tech Development Zone, Wuhan City, Hubei Province
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+862765524712
The 2025 China International Compound Semiconductor Industry Expo will showcase a range of cutting-edge semiconductor technologies and materials, including wafers, chips, photoresists, wafer tapes, photomasks, electronic gases, CMP polishing materials, and resist materials. The exhibition will also feature wet electronic chemicals, sputtering targets, packaging materials, slicing, grinding, polishing sheets, and various films, presenting the latest advancements in semiconductor manufacturing and materials technology to industry experts and attendees.
In terms of equipment, the expo will display a variety of tools including film deposition equipment (such as CVD, PVD, ALD), thermal treatment equipment, photolithography machines, and etching machines. Additionally, ion implantation equipment, cleaning equipment, epitaxial equipment, as well as cutting, grinding, polishing equipment, sintering equipment, and testing instruments will be exhibited, providing a comprehensive semiconductor production solution.
Exhibiting companies will consist of wafer manufacturers, IDMs, OEMs, and a variety of semiconductor power devices and discrete device design and manufacturing. These devices include diodes, transistors, IGBTs, thyristors, MOSFETs, sensors, relays, and switches. Such a diverse exhibition will allow visitors to gain insights into the latest technological trends in the industry and the development outlook for the future.
In terms of equipment, the expo will display a variety of tools including film deposition equipment (such as CVD, PVD, ALD), thermal treatment equipment, photolithography machines, and etching machines. Additionally, ion implantation equipment, cleaning equipment, epitaxial equipment, as well as cutting, grinding, polishing equipment, sintering equipment, and testing instruments will be exhibited, providing a comprehensive semiconductor production solution.
Exhibiting companies will consist of wafer manufacturers, IDMs, OEMs, and a variety of semiconductor power devices and discrete device design and manufacturing. These devices include diodes, transistors, IGBTs, thyristors, MOSFETs, sensors, relays, and switches. Such a diverse exhibition will allow visitors to gain insights into the latest technological trends in the industry and the development outlook for the future.
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