PAIC 2027 First Hangzhou Bay International Physics AI Conference and Exhibition

PAIC 2027 First Hangzhou Bay International Physics AI Conference and Exhibition
25 March - 27 March, 2027
Hangzhou International Expo Center
Hangzhou, Zhejiang
353 Benjing Avenue, Qianjiang Century City, Xiaoshan District, Hangzhou City, Zhejiang Province
浙江省杭州市萧山区钱江世纪城奔竞大道353号

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Area: 30,000 m2
Exhibitors: 700+
Visitors: 50,000+
The first Hangzhou Bay International Physics AI Conference and Exhibition will be held in 2027, planning five major themed halls covering a total area of 30,000 square meters. It is anticipated that over 700 brands from the physics AI industry chain will participate, welcoming more than 50,000 professional visitors from both domestic and international backgrounds. Additionally, over 20 specialized procurement teams from manufacturing, healthcare, biomedicine, intelligent computing centers, and robotics integrators will be invited to facilitate business connections.

The exhibition will cover various fields such as simulation virtual training, multi-modal sensing and world models, computing foundations, key robot components, and integrated solutions for humanoid, industrial, and medical robots across vertical industries. Leveraging Hangzhou's extensive intelligent embodied industry cluster and the resources of the National Science Communication Center, the event aims to create a professional exchange and cooperation platform that integrates cutting-edge technology launches, industry forum discussions, one-on-one supply-demand matching, and national project selection.

The core exhibit range will be spread across several areas:
Area A will showcase computing power, AI chips, and intelligent computing infrastructure, featuring high-performance chips, edge AI accelerators, and intelligent servers,光模块 (optical modules), and more.

Area B will be the main showcase for complete machines, robot bodies, and industry solutions, focusing on humanoid, industrial, service, and special robots, as well as medical robots, along with solutions for smart manufacturing, logistics, and energy sectors.

Area C will feature key robot components, including servo motors, reducers, integrated joints, dexterous hands, and tactile sensors.

Area D will focus on multi-modal sensing and world modeling, showcasing products such as 2D/3D vision, LiDAR, tactile sensors, and corresponding algorithms.

Area E will present technologies related to simulation, digital twins, and virtual training, including physics simulation engines, digital twin platforms, AI synthetic data, and robotic virtual training environments.
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