2027 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition
18 May - 20 May, 2027
Hefei Binhu International Convention and Exhibition Center
Hefei, Anhui
3899, Jinxiu Avenue, Baohe District, Hefei
安徽省合肥市包河区锦绣大道3899号
Hefei, Anhui
3899, Jinxiu Avenue, Baohe District, Hefei
安徽省合肥市包河区锦绣大道3899号
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As global digital transformation accelerates, semiconductors have become the "industrial heart" of the digital age, serving as the fundamental cornerstone for key strategic areas such as 5G, artificial intelligence, new energy vehicles, and advanced computing. As a strategic and foundational national industry, semiconductors have received multiple policy supports under initiatives like "Made in China 2025" and the "14th Five-Year Plan," leading to a steady expansion of the global market and a rapid restructuring of the industry landscape, hence presenting significant development opportunities.
The "2027 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition" will be grandly held from May 18 to 20, 2027, at the Hefei Binhu International Exhibition Center. The exhibition continues with the core theme of "Winning the Chip Era, Creating a Chip Future" and is based on Hefei's industrial advantages as the "Capital of China's IC" and the dividends from the Yangtze River Delta integrated development strategy, focusing on the innovative synergy of the entire semiconductor industry chain while aiming to create an international high-end platform that integrates technology display, business matching, academic exchanges, and ecological co-construction.
The exhibition will assist domestic and foreign enterprises in deepening cooperation and sharing development opportunities, collectively crafting a new blueprint for global semiconductor industry development. The 2027 exhibition is set to further expand and upgrade, striving to attract more global leading enterprises and top research institutions to participate, focusing on technological breakthroughs, supply-demand matching, cross-border cooperation, and talent exchange. By fostering collaborative innovation, it will help domestic and foreign enterprises seize industry opportunities and work together to build a new ecosystem for the semiconductor industry, promoting high-quality global semiconductor industry development.
In the review of the last exhibition, renowned companies from Hefei and beyond gathered, including Hefei Xianwei Semiconductor, Yiyue Technology, and Hockheimer, with over 300 distinguished participants showcasing state-of-the-art technologies, core equipment, and innovative solutions, greatly promoting the deep integration of the industry and supply chains.
Moreover, the exhibition is clearly divided into various areas covering IC design, integrated circuit manufacturing, materials, equipment, electronic components, new displays & smart terminals, big data and artificial intelligence, among others. Each area showcases the latest technologies and products in the industry. For instance, the IC design area features various chip designs, including 5G communication chips and AI chips; the integrated circuit manufacturing area focuses on wafer production; and the materials area spans a wide range of semiconductor materials. These zones will provide exhibitors with opportunities to showcase technology, engage in business discussions, and facilitate cooperation, further advancing the semiconductor industry.
The "2027 China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition" will be grandly held from May 18 to 20, 2027, at the Hefei Binhu International Exhibition Center. The exhibition continues with the core theme of "Winning the Chip Era, Creating a Chip Future" and is based on Hefei's industrial advantages as the "Capital of China's IC" and the dividends from the Yangtze River Delta integrated development strategy, focusing on the innovative synergy of the entire semiconductor industry chain while aiming to create an international high-end platform that integrates technology display, business matching, academic exchanges, and ecological co-construction.
The exhibition will assist domestic and foreign enterprises in deepening cooperation and sharing development opportunities, collectively crafting a new blueprint for global semiconductor industry development. The 2027 exhibition is set to further expand and upgrade, striving to attract more global leading enterprises and top research institutions to participate, focusing on technological breakthroughs, supply-demand matching, cross-border cooperation, and talent exchange. By fostering collaborative innovation, it will help domestic and foreign enterprises seize industry opportunities and work together to build a new ecosystem for the semiconductor industry, promoting high-quality global semiconductor industry development.
In the review of the last exhibition, renowned companies from Hefei and beyond gathered, including Hefei Xianwei Semiconductor, Yiyue Technology, and Hockheimer, with over 300 distinguished participants showcasing state-of-the-art technologies, core equipment, and innovative solutions, greatly promoting the deep integration of the industry and supply chains.
Moreover, the exhibition is clearly divided into various areas covering IC design, integrated circuit manufacturing, materials, equipment, electronic components, new displays & smart terminals, big data and artificial intelligence, among others. Each area showcases the latest technologies and products in the industry. For instance, the IC design area features various chip designs, including 5G communication chips and AI chips; the integrated circuit manufacturing area focuses on wafer production; and the materials area spans a wide range of semiconductor materials. These zones will provide exhibitors with opportunities to showcase technology, engage in business discussions, and facilitate cooperation, further advancing the semiconductor industry.
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