2026 ELEXCON Shenzhen International Electronics and Embedded Exhibition

From September 9 to 11, 2026, the 23rd ELEXCON Shenzhen International Electronics and Embedded Exhibition, hosted by Informa Markets, will take place at the Shenzhen International Convention and Exhibition Center (Baoan), alongside the CIOE China Optical Expo and the IICIE International Integrated Circuit Innovation Expo. This joint event will cover a total area of 340,000 square meters, serving as a premier platform for the release and promotion of new technologies and products. This joint exhibition aims to leverage collaborative strengths to initiate an innovative journey, achieving resource integration to complement each other’s advantages, breaking industry barriers, and accelerating the integration of the electronic embedded industry with the optoelectronic industry ecosystem, creating more opportunities for collaboration along the industry chain.

The event will gather over 5,000 exhibitors, covering core enterprises of the entire electronic and embedded industry chain and optoelectronic sectors. The variety of exhibits will range from basic components to end solutions, showcasing everything from cutting-edge technology prototypes to market-ready applications, fully revealing the industry's development landscape. Over 240,000 professional visitors are expected, including more than 7,000 international visitors from 97 countries and regions, covering seven key application fields such as consumer electronics, automotive, communications, data centers, medical, industrial, and IoT. This diverse audience includes C-level executives, R&D engineers, procurement managers, and technical decision-makers, providing exhibitors with accurate business networking opportunities.

Moreover, over 100 forums will be held concurrently, featuring more than 1,000 leading industry speakers discussing cutting-edge topics in AI, electronics, embedded systems, and optoelectronic communications, creating a thought leadership feast that will help businesses seize technological trends and market opportunities.

ELEXCON 2026 is set to be an essential event focusing on electronics and embedded technologies in Shenzhen and the greater South China region, with the theme of "All for AI, All for Green." The exhibition will primarily showcase core sections including chips, storage, embedded and edge AI, power and power semiconductors, and automotive electronics. The audience will include engineers, developers, procurement managers, and technical decision-makers from domains like consumer electronics, automotive, communications, data centers, medical electronics, industrial control, and IoT. ELEXCON is dedicated to building a one-stop platform for technical communication, learning, and product selection for engineers and technical decision-makers, assisting enterprises in keeping up with industry trends and connecting with high-quality collaborative resources.

As a core professional exhibition within the joint events, the Electronics and Embedded Special Exhibition (Hall 17) will focus on displaying chips, storage, embedded and edge AI, power and power semiconductors, automotive electronics, and related modules and system solutions, creating a one-stop learning and selection platform for engineers and technical decision-makers. The showcased embedded products will include embedded processors (MCU, MPU, SoC, FPGA, DSP), embedded AI and edge computing solutions, storage, embedded modules, development boards, operating systems, debugging and simulation tools, communication modules (both wired and wireless), sensors and actuators, power management ICs, and comprehensive AIoT solutions. The electronic components section will feature semiconductor ICs, power supplies, power semiconductors, testing and measurement technologies, high-speed connection technologies and connectors, wiring harnesses and cable assemblies, relays and switches, passive components (capacitors, inductors, oscillators), MEMS and sensors, automotive electronics, and thermal management products.