2026 International Electronics Circuit (Shenzhen) Exhibition
2 December - 4 December, 2026
Shenzhen World Exhibition and Convention Center
Shenzhen, Guangdong
No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
广东省深圳市宝安区福海街道展城路一号
Shenzhen, Guangdong
No. 1 Zhancheng Road, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
广东省深圳市宝安区福海街道展城路一号
+8675586240033
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With the continuous rise in demand for generative AI, computing infrastructure, and high-performance computing, the global electronics industry is entering a new cycle of structural growth led by AI. According to reports, the global PCB market is expected to reach USD 96.8 billion by 2025, with a compound annual growth rate of about 5.8%, showing significant momentum in growth.
On the technological front, high-density interconnect (HDI), IC substrates, advanced packaging substrates, and other high-end PCBs are becoming core requirements in AI application scenarios, particularly in sectors such as automotive, communication products, computers, consumer electronics, military/aerospace, and industrial/medical applications.
The 2026 International Electronics Circuit (Shenzhen) Exhibition will focus on this trend, addressing how AI is driving technology, and supporting leading industry players to capture strategic opportunities stemming from AI advancements. The exhibition will showcase a variety of PCB applications and products, including connector PCBs, high-density interconnect printed circuit boards, rigid and flexible printed circuit boards.
Various topics will be addressed through presentations and displays, including electrical testing, reliability engineering, and environmentally friendly clean production technology. Participating exhibitors will demonstrate the latest PCB manufacturing processes and equipment while discussing the implementation of AI technologies to achieve smart manufacturing. This exhibition will gather innovations and cutting-edge technologies, providing a valuable communication platform for attendees to thrive in a competitive market.
On the technological front, high-density interconnect (HDI), IC substrates, advanced packaging substrates, and other high-end PCBs are becoming core requirements in AI application scenarios, particularly in sectors such as automotive, communication products, computers, consumer electronics, military/aerospace, and industrial/medical applications.
The 2026 International Electronics Circuit (Shenzhen) Exhibition will focus on this trend, addressing how AI is driving technology, and supporting leading industry players to capture strategic opportunities stemming from AI advancements. The exhibition will showcase a variety of PCB applications and products, including connector PCBs, high-density interconnect printed circuit boards, rigid and flexible printed circuit boards.
Various topics will be addressed through presentations and displays, including electrical testing, reliability engineering, and environmentally friendly clean production technology. Participating exhibitors will demonstrate the latest PCB manufacturing processes and equipment while discussing the implementation of AI technologies to achieve smart manufacturing. This exhibition will gather innovations and cutting-edge technologies, providing a valuable communication platform for attendees to thrive in a competitive market.
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